Advanced Materials Cover Article with Ko Lab @SNU

Our recent paper with Seung Hwan Ko’s lab at Seoul National University made the inside cover of Advanced Materials. This study, led by the SNU team, introduces a method to create highly stretchable soft circuits with liquid metal wiring and embedded microelectronic chips. Stiffness gradients are engineered into the surrounding rubber to improve the mechanical support around the chips and prevent tearing or delamination during stretching.

You can read the paper here.